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Stechron SS50
 Stechron SS50 is a thread solder in which copper is added to a tin-leaded alloy to prevent the phenomenon of copper erosion. Suitable applications are for extra fine copper wires and copper foil.
- Stechron flux has the effect of forcing out the molten resin of resinshielded wires, thus shortening soldering time and preventing the solder form thinning due to heat.
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| Types |
Melting point (°C) |
Specific Gravity
(g/CM2) |
Applications |
Wire diameter (mmø) |
Unit weight (kg) |
| Stechron SS50 |
183~215* |
8.9 |
For extra-fine urethane-shielded copper wires, voice coils, etc. |
1.6, 1.2
1.0, 0.8 |
1.0 |
| 0.6 |
0.5 |
| * The separation point of copper-tin alloy is near 360 °C, higher than that of the liquidus. Therefore, soldering near 360 °C, results in only a small loss of copper. The copper content is 1-2%. |
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