Under stencil wipe is used for cleaning under stencils between prints. This wipe effectively removes residual solder paste with or without the use of solvents. The purpose for the under stencil wipe is to keep the underside of the stencil clean and free from solder paste and flux between prints. This help to prevent smearing which otherwise can result to solder short and reduce aperture clog.

SMT under stencil wipe are available in various sizes to fit various models of printers.

SMT loose stencil wipe can be effectively apply in the maintenance of devices, manual cleaning of the sencil to remove any excess solder paste left behind and the cleaning of screen.

SMT loose stencil wipe are abailable in various sizes as follows:

1) 4" x 4"

2) 6" x 6"

3) 9" x 9"

Other products include:

Thermal Paper and Stencil Cleaning Chemical