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Product Range
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Rosin Mold Activated (RMA) Paste which contain RMA type satisfies QQ-S-571E. It is also manufactured with uniform particle size low oxides sperical solder powder. Flux residue after soldering is a highly reliable coating with excellent insulation property, most suitable for 0.3mm pitch such as QFP.
For low residual flux after reflow requirements for in-circuit testing, the RMA-10-19 is recommended.
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Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (m) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| RMA-10-19 |
Sn37Pb |
183 |
22-45 |
0.0 |
9.5 |
200 |
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For normal SMT applications the following series is applicable.
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Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (m) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| RMA-10-23 |
Sn37Pb |
183 |
20-38 |
0.0 |
12.0 |
110 |
| RMA-10-29T |
Sn37Pb |
183 |
20-38 |
0.08 |
10.0 |
180 |
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The RMA-012 solder paste flux series is developed for anti-tombstoning effect.
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Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (m) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| RMA-012-FP |
Sn36.8Pb0.4Ag |
179-183 |
22-45 |
0.13 |
9.5 |
200 |
| RMA-012-FP3 |
Sn36.8Pb0.4Ag |
183 |
20-38 |
0.08 |
10.0 |
170 |
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The Tamura NC7 Solder paste is a RMA type, with high reliability satisfying the requirements of "Bellcore" specifications, GR-78-CORE and J-STD. The spherical solder powder has very little oxides.
The excellent film resolution and continuous printability given by the use of a newly developed, highly thixotropic flux assure stable printing of fine patterns like 0.4mm-pitch QFP.
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Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (m) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| NC7-E4-200 |
Sn63/Pb37 |
183 |
20-45 |
0.0 |
9.5 |
200 |
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