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Arlon MED
Arlon Materials for Electronics (MED), a Division of Bairnco Corp. of Orlando FL, www.bairnco.com, is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. We offer over 45 years of continuous experience, and high tech PCB materials are our only business.
Arlon MED is comprised of 2 product groups:
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Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid.
Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products).
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Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and other laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as basestations and antennas for wireless telecommunications infrastructure.
These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits.
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Our facilities in California and Delaware employ state of the art production equipment, engineered to provide cost-effective, flexible manufacturing capacity to permit quick response to customer requirements while meeting the most stringent quality and tolerance demands. Both of our manufacturing sites are ISO 9002 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer’s requirements.
Arlon maintains a significant commitment to research & development. In the past few years, we have introduced several product innovations for high performance, cost-effective circuit board applications, including 55ST & 65GT – respectively, high peel strength and halogen-free flame retardant non-woven aramid laminate and prepreg systems, and the first high Dk, super-thin ceramic-filled PTFE substrate on woven glass – AR1000 at a Dk of 10.2 and a thickness of 0.0024”. You can expect to see additional product innovations from our development pipeline in the months and years to come.
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