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Tamura Lead Free Solder Paste products consists of the different flux content series of TLF-19A, TLF-43 and TLF-49. These Lead Free solder Pastes series are composed of Pb-free spherical solder powder with very low oxide content and a high reliable flux. As the paste contains no lead it will contribute to the protection of the global environment. The solder paste also employs a specially developed high thixotropic flux which enables excellent resolution during continuous printing of line patterns.
Product Range
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Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (µm) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| TLF-201-19A |
Sn3.5Ag 0.7Cu |
215-221 |
20-38 |
0.0 |
11.8 |
210 |
| TLF-204-19A |
Sn3.0Ag 0.5Cu |
216-220 |
20-38 |
0.0 |
11.8 |
210 |
| TLF-204-43 |
Sn3.0Ag 0.5Cu |
216-220 |
20-38 |
0.0 |
11.4 |
220 |
| TLF-2046-19A |
Sn3.9Ag 0.6Cu |
216-221 |
20-38 |
0.0 |
12 |
210 |
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- New Lead Free Non-Crack Flux
In rosin based flux residue, cracks occurs after thermal cycle test (3000 cycles from minus 30°C to positive 80°C). This leads to a decline in electrical reliability as moisture is absorbed through the cracks.
The TLF-21 series will prevent cracks from developing in the flux residue and enhance the following:
- Flux residue will exhibit excellent electrical reliability
- Occurrence of ion migitation can be prevented
- Non-cleaning can be achieved for printed circuit boards demanding high reliability
- Residue will not peel off when using conformal coating
|
Product
name |
Alloy
composition |
Melting
point (°C) |
Particle size of
solder powder (m) |
Chlorine
contect (%) |
Flux
content (%) |
Viscosity
(Pa - s) |
| TLF-204-21 |
Sn3.0Ag 0.5Cu |
216-220 |
20-38 |
0.0 |
11.4 |
220 |
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