C.T.S Industries (S) Pte Ltd
Your Reliable Partner In soldering and PCB solutions

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LAY-UPS
RECOMMENDED LAY-UP PROCEDURES
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PACOTHANE Lamination System

RIGID MULTILAYER PROCESS


+


*(Pacothane Release Film
- recommended two sides)

Tooling Plate
PACOPADS Press Pads*
S.S. Separator Plate
PACOTHANE Release Film
Multilayer Panel
PACOTHANE Release Film
S.S. Separator Plate
PACOPADS Press Pads*
Tooling Plate

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Tooling Plate
PACOPADS Press Pads*
S.S. Separator Plate
PACO-VIA Resin Blocking Film
Multilayer Panel
PACO-VIA Resin Blocking Film
S.S. Separator Plate
PACOPADS Press Pads*
Tooling Plate

PACO-VIA Resin-Blocking System

BLIND/BURIED VIA MULTILAYER


+


*(Pacothane Release Film
- recommended two sides)
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PACOPLUS System

FLEXIBLE & RIGID-FLEX CIRCUITS


+


*(Pacothane Release Film
- recommended against separator plate)

Tooling Plate
S.S. Separator Plate
PACOPADS Press Pads*
PACOTHANE PLUS
Multilayer Panel
PACOTHANE PLUS
PACOPADS Press Pads*
S.S. Separator Plate
Tooling Plate

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Tooling Plate
S.S. Separator Plate
PACOPADS Press Pads*
PACOLON Release Film
Multilayer Panel
PACOLON Release Film
PACOPADS Press Pads*
S.S. Separator Plate
Tooling Plate

High Temp PACOLON System

HIGH TEMPERATURE FLEXIBLE CIRCUITS


+


*(Pacothane Release Film
- recommended against separator plate)

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