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Tamura Flux is widely known and regarded in the Electronics Industry for its Quality and Reliability. Each Flux is specially formulated for specific application in the PCB Manufacturing Industry, PCB Assembly House and the Semi-Conductor Industry.
Product Range
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Solderite CF series are mat type flux for foam application developed for the soldering of printed circuit boards with chip components and flat Ics that are designed for compact and high density packaging.
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Product
name |
Solid
content (%) |
Chlorine
content (%) |
Specific
gravity |
Spreading
factor (%) |
Soldered
surface |
| CF-100VS |
12 |
0.06 |
0.818 |
92 |
mat |
| CF-110VH-2A |
14 |
0.08 |
0.820 |
93 |
mat |
| CF-111V |
12 |
0.0 |
0.816 |
92 |
mat |
| CF-330VH |
17 |
0.09 |
0.830 |
93 |
mat |
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Solderite ULF Series are Ultra low residue flux type flux and these are developed for soldering printed circuit board mounted chip components and flat Ics which are for miniaturize and high density purpose. There should not be any issues regarding probe pins unable to contact solder joints as the flux residue is almost negligible.
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Product
name |
Solid
content (%) |
Chlorine
content (%) |
Specific
gravity |
Spreading
factor (%) |
Soldered
surface |
| ULF-210R |
5 |
0.0 |
0.802 |
88 |
gloss |
| ULF-300VZ-3 |
7.5 |
0.04 |
0.808 |
91 |
mat |
| ULF-300Z |
6.2 |
0.04 |
0.800 |
92 |
gloss |
| ULF-500VS |
8.5 |
0.04 |
0.806 |
90 |
mat |
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Solderite CTF Series are water soluble flux developed for automatic soldering of printed circuit boards. the flux residue after soldering is easily removed with water and white residue does not appear after cleaning. It is especially suitable for flow type soldering of printed circuit boards that require high reliability.
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Product
name |
Solid
content (%) |
Chlorine
content (%) |
Specific
gravity |
Spreading
factor (%) |
| TF-40E |
10 |
0.18 |
0.83 |
92 |
| TF-41 |
10 |
0.41 |
0.828 |
90 |
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Solderite EC Series are high performance lead free flux developed for automatic soldering using Pb-free solders and achieve excellent solderability. This series of flux will demonstrate excellent performance for the soldering of printed circuit boards designed for high density mounting in Pb-free soldering.
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Product
name |
Solid
content (%) |
Chlorine
content (%) |
Specific
gravity |
Spreading
factor (%) |
Soldered
surface |
| EC-19S-7 |
15 |
0.08 |
0.824 |
85 |
mat |
| EC-19S-8 |
15 |
0.08 |
0.822 |
92 |
mat |
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